Ansys 2021 R1 Launches
Engineers can harness advances in simulation technology together with increasing computing power to drive new levels of product innovation.
January 28, 2021
Newly launched Ansys 2021 R1 products deliver improvements in simulation technology along with the compute power of high-performance computing to reimagine what is possible for global engineering teams.
Product enhancements in Ansys 2021 R1 create opportunities for engineers to accomplish design and product development goals. With Ansys 2021 R1, engineers no longer need to develop workarounds because of technology limitations and make workflow compromises that increase design cost and risk.
Ansys 2021 R1 provides advancements for large electromagnetic system simulations that previously were not possible while including vendor components in those simulations with greater efficiency and scalability. These components can be encrypted, so vendors can share proprietary 3D component designs and create high-fidelity simulations.
Ansys 2021 R1 pushes semiconductor engineering boundaries, delivering analysis of signal integrity, power integrity, thermal and mechanical stress on 3D multi-die systems. While thermomechanical stresses and warpage can damage 3D-IC packages, leveraging Ansys flagship technology enables users to increase product lifespan and reliability.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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