Digital Engineering July/August 2023

The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, and a review of the BOXX APEXX S3 workstation.

Inside This Issue:

Subscription-Based Software: The New Normal?

Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.  

SaaS Gains Ground in ECAD 

Simulation drives ECAD to subscription.

Playful Magic and Functional Esthetics

Incorporating electronics to raise the bar for toys and accessories. 

How Well Can PLM Support Electronics Developers?

Until now, PLM has made limited inroads into the electronics design and development sector.

Production-grade AM Gets Quality Boost 

Advances in artificial intelligence, in-situ monitoring and process control are picking away at longstanding concerns about additive manufacturing  part quality, but more work needs to be done.

Choosing the Right Computing Options for Enhanced Workflows

Getting the ideal hardware for your engineering applications isn’t just about the price tag.

Top Performance Winner: BOXX APEXX S3

The latest workstation from BOXX beats the performance of its predecessor.

Download today

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3E EOS Expands AM Capabilities With Help From Stratasys
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UCF Joins Digital Twin Consortium as Regional Organizer
University of Central Florida Research Foundation joins DTC as Regional Branch Organizer for Southeast USA

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