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SaaS Gains Ground in ECAD
Simulation drives ECAD to subscription.
Cadence Integrity 3D-IC platform supports Samsung’s new 3D CODE standard.

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Special Industry Focus: Electronics Design
In this Special Focus Issue of Digital Engineering, learn about new innovations in electronics design, including printed electronics, 5G design, and eCAD.


EMA to Create Accelerated Designs IP Company
New spinoff business unit will provide multi-CAD support & expertise worldwide, EMA reports.
Keysight Highlights EDA 2024 Integrated Software Tools
This integrated EDA software is designed to increase productivity for engineers developing high-speed products in multiple applications, the company reports.
Zuken Introduces AIPR for CR-8000
Company offers a three-stage approach to artificial intelligence-powered printed circuit board design within its flagship CR-8000 platform.
Altair and EMA Design Automation Integrate Solutions
Ultra Librarian gives Altair users access to more than 16 million symbols, footprints and 3D models.
Zuken Unveils CR-8000 2023 for PCB Designs
The 2023 release is packed with enhancements covering the design process.
SaaS Gains Ground in ECAD
Simulation drives ECAD to subscription.
Playful Magic and Functional Esthetics
Incorporating electronics to raise the bar for toys and accessories.
Boston Micro Fabrication Secures $24M Series D Funding
The new capital infusion will support development of end-use products across life sciences, dental and electronics industries.
Nano Dimension Acquires Additive Flow Technology
This technology is said to be an enabler for leveraging additive manufacturing, and it enhances DeepCube's deep learning capabilities, Nano Dimension reports.
Subscription-Based Software: The New Normal?
Licensing models are slowly changing to be subscription based across the industry. But many organizations still use perpetual licensing.
PLM-Supported Electronics: How Well Can PLM Support Electronics Developers?
Until now, PLM has made limited inroads into the electronics design and development sector.
Digital Engineering July/August 2023
The July/August issue of Digital Engineering focuses on innovations in electronics design, including cloud-based ECAD, electronic toy design, PLM for electronics, quality control in 3D printing, a review of the BOXX APEXX S3 workstation, and reports from NAFEMS and...
Intel Certifies Ansys Multiphysics Solutions for Signoff Verification
Ansys electromagnetic analysis tools optimize semiconductor products for high-performance computing, 5G and AI applications.
Siemens Expands Partnership with AWS
The goal is to focus on helping mutual integrated circuit (IC) and electronics design customers leverage AWS’s advanced cloud services to shorten design cycles, the companies report.
Ansys and Altium Boost Electronics Design with Digital Plan
Ansys and Altium aim to further streamline electronics design and development with integration between ECAD and simulation.



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 Lithoz and Oak Ridge National Laboratory Team Up to Advance Ceramics
Technical collaboration agreement will focus on innovating high-temperature ceramics processing viathe use of Lithoz 3D printing technology.

EMA to Create Accelerated Designs IP Company
New spinoff business unit will provide multi-CAD support & expertise worldwide, EMA reports.

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