Siemens Releases AI-Augmented Electronic Systems Design Software

Latest release combines Xpedition, Hyperlynx and PADS Professional software via unified user experience with cloud connectivity and collaboration, company reports.

Latest release combines Xpedition, Hyperlynx and PADS Professional software via unified user experience with cloud connectivity and collaboration, company reports.

The next-generation release of Xpedition is designed to simplify complex printed circuit board design processes with an enhanced, AI-assisted, user experience. Image courtesy of Siemens.


Siemens Digital Industries Software issues its latest advancement in its electronic systems design portfolio. The next-generation release uses an integrated and multidisciplinary approach, bringing together Xpedition software, Hyperlynx software and PADS Professional software into a unified user experience that delivers cloud connectivity and artificial intelligence (AI) capabilities.

“We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today's electronics engineers and the wider engineering community,” says A.J. Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head-on.” 

Focused on offering  intuitive tools, the next-generation toolset adds predictive engineering and new support assistance using AI, enhancing engineers’ capabilities, streamlining, and optimizing their workflows, according to Siemens. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialized services and resources, enabling engineers to adapt to changing requirements, supply chain insights and easier collaboration with stakeholders, regardless of location, SIemens adds.

The next generation software also brings enhanced integration with Siemens’ Teamcenter software for product lifecycle management and NX software for product engineering, allowing for multi-bill of maaterials support and tighter collaboration between electronic CAD and mechanical CAD domains. For security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to strict industry protocols. Siemens maintains partnerships with cloud providers to ensure security measures. The solution also includes design and verification requirements management for model-based systems engineering support. 

Siemens' next-generation electronic systems design solution, including Xpedition NG software and HyperLynx NG software are now available, and PADS Pro NG software will be available in the second quarter of 2025.  

To learn more about Electronic Systems Design software from Siemens, click here.

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